Home Clean Hair Products Shampoo & Conditioner

Label.m M-Plex Bond Repairing Conditioner

Label.m M-Plex Bond Repairing Conditioner 300ml

$63.00

Only 7 remaining in stock!

In Stock - Free Shipping Estimated delivery: Fri, May 23rd - Wed, May 28th

130 DAY RETURNS

YOUR FREE GIFT

Free Mary Katrantzou Designer scarf when you purchase 2 Label.m products. Minimum spend $70.

Dualsenses Bond Pro 60sec Treatment Mini

YOUR FREE GIFT

FREE Goldwell Bond Pro 60-Second Treatment When You Spend $120+ Sitewide

Why You’ll love it

Intensively repair and protect disulphide hair bonds with our M-Plex Bond Technology.

Deeply hydrates with our exclusive Hydropower Bond Technology.

Leaves hair feeling noticeably stronger and smoother.

Nourishes and seals the cuticle for smoother, healthier-looking hair.

Delivery Estimate

Click & Collect

Shop online and pick-up in store

Same Day Delivery with

Guaranteed Melbourne Metro - Order by 12:30pm

Description

Experience the transformative power of Label.m's M-Plex Bond Repairing Conditioner, an innovative solution designed to intensively repair and protect your hair bonds from breakage. Enriched with the exclusive M-Plex Bond Technology and Hydropower Bond Technology and infused with the nourishing properties of coconut water and Abyssinian Oil, this remarkable conditioner leaves your hair noticeably stronger and smoother. Unleash the potential of your hair by exploring the benefits of M-Plex Bond Repairing treatments, available through professional hairdressers.

Immerse your hair in the reparative embrace of M-Plex Bond Technology, a cutting-edge bond-building technology formulated to diligently repair and protect disulphide hair bonds. Experience the deep hydration provided by the exclusive Hydropower Bond Technology, a blend enriched with coconut water and Abyssinian oil. Together, they work harmoniously to nourish your hair and seal the cuticle, resulting in smoother and healthier-looking locks.

Feel the difference as your hair becomes noticeably stronger and smoother with each use of this exceptional conditioner. It effortlessly works to fortify your hair bonds, providing the protection needed to prevent breakage and damage. Embrace hair that is not only resilient but also exudes a captivating smoothness that invites touch.

Directions

How To Use Label.m M-Plex Bond Repairing Conditioner

Apply to wet hair, massage gently and rinse. Use with Label.m M-Plex Bond Repairing Shampoo for best results.

Ingredients

Label.m M-Plex Bond Repairing Conditioner Ingredients

Aqua (Water/Eau), Cetearyl Alcohol, Caprylic/Capric Triglyceride, Glycerin, Behentrimonium Chloride, Quaternium-91, Fragrance/Parfum, PPG-3 Benzyl Ether Myristate, Bis-PCA Dimethicone, Disodium PEG-12 Dimethicone Sulfosuccinate, Divinyldimethicone/Dimethicone Copolymer, Hydrolyzed Adansonia Digitata (Baobab) Extract, Hydrolyzed Linseed Seed, Aloe Barbadensis Leaf Juice, Camellia Sinensis (Green Tea) Leaf Extract, Aspalathus Linearis (Rooibos) Leaf Extract, Cocos Nucifera (Coconut) Liquid Endosperm, Lycium Barbarum (Goji) Fruit Extract, Olea Europaea (Olive) Fruit Oil, Crambe Abyssinica (Abyssinian) Seed Oil, C12-13 Pareth-23, C12-13 Pareth-3, Amodimethicone, C11-15 Pareth-7, Laureth-9, Cetrimonium Chloride, Trideceth-12, Vitis Vinifera (Grape) Seed Oil, Helianthus Annuus (Sunflower) Seed Oil, Glycine Soja (Soybean) Oil, Cetyl Esters, Panthenol, PEG 45M, Isododecane, Phenoxyethanol, Isopropyl Alcohol, Glycerin, Olea Europaea (Olive) Fruit Extract, Malpighia Glabra (Acerola) Fruit Extract, Persea Gratissima (Avocado) Oil, Polysilicone-15, Butylene Glycol, Helianthus Annuus (Sunflower) Seed Extract, Salvia Hispanica (Chia) Seed Extract, Saccharomyces Cerevisiae (Brewer's Yeast) Extract, Leuconostoc/Radish Root Ferment Filtrate, Maltodextrin, Guar Hydroxypropyltrimonium Chloride, Sodium Chloride, Aminomethyl Propanol, Benzoic Acid, Disodium EDTA, Benzyl Alcohol, Sodium Benzoate, Potassium Sorbate, Citric Acid, Ethylhexylglycerin, Linalool, Benzyl Benzoate, Limonene.

Questions and Answers

Write A Question

Name

E-mail

Your Question

Reviews

Write a review

Your evaluation

Name

E-mail

Your Review